Product Specifications
|
Specification |
Available Range / Standard |
|
Connector Formats |
Wire-to-board, board-to-board, FPC / FFC, power-control, and insert-molded connectors |
|
Contact Pitch |
0.35-5.08 mm |
|
Circuit Count |
2-240 circuits |
|
Complete Connector Current |
0.3-20.5 A per contact |
|
Complete Connector Voltage |
50-250 V AC/DC |
|
Operating Temperature |
-40°C to +125°C |
|
Housing Materials |
LCP, PA46, PA66, PA6T, and PA9T flame-retardant engineering plastics |
|
Dimensional Tolerance |
±0.05 mm |
|
Mated Height |
0.6-25.5 mm |
|
Complete Connector Electrical Validation |
Insulation resistance ≥50 MΩ; dielectric withstand 100-500 V AC, 1 min |
|
Mounting And Orientation |
SMT or through-hole; vertical, right-angle, parallel, or coplanar layout |
|
Packaging |
Embossed tape and reel, tray, tube, or compartment packaging |
Key Features
● Stable Contact Position At Fine Pitch
The terminal cavities, guide slots, retention shoulders, and mating faces follow the approved contact layout. This geometry helps prevent pin shift, housing interference, and uneven contact engagement during automated terminal insertion, PCB assembly, and repeated mating.
● High-Temperature And Flame-Retardant Resin Options
Available engineering plastics include LCP, PA46, PA66, 6T, and 9T. The grade is chosen from the required reflow exposure, operating temperature, insulation, and mechanical performance. In SMT connector bodies and compact power electronics, the resin must retain the wall shape and contact pitch through the specified heat cycle.
● Thin-Wall And Insert-Molded Structures
Precision molding and insert molding can form micro ribs, narrow slots, deep cavities, metal contacts, shields, and locating inserts in one component. This reduces secondary assembly and keeps the alignment needed for board placement and mating.
Customization Options
● Connector Interface
Customize the connector format, pitch, position count, and orientation to the approved mating layout.
● Insulator Structure
Specify the resin grade, contact-cavity design, and electrical spacing required by the assembly.
● Assembly And Handling
Define terminal retention, PCB locating features, and the tray, tube, or reel format used downstream.
Customization Process
Requirement Confirmation
Confirm the contact drawing, mating layout, and board-assembly conditions.
Engineering Review
Validate thin-wall filling, contact positioning, and warpage risk before mold release.
Mold Design And Manufacturing
Develop precision cavities and core pins around the specified pitch and terminal geometry.
Trial Molding And Sample Approval
Approve contact fit, mating behavior, coplanarity-related dimensions, and thermal response on trial parts.
Production And Inspection
Control resin preparation, core-pin condition, and critical interface dimensions in every lot.
Packing And Delivery
Pack parts in the agreed automation format and identify each lot by part number and revision.
Quality Control
● Resin And Drying Control
Before molding, the material grade, flame-retardant specification, lot number, color, and drying condition are checked. This helps avoid hydrolysis, surface defects, and dimensional variation.
● Cavity And Contact-Fit Inspection
Pitch, terminal cavities, mating face, board pegs, latch features, and coplanarity-related dimensions are measured with optical or contact equipment. Dedicated pins or mating contacts are then used to verify insertion and retention.
● Heat And Functional Validation
If the drawing requires a reflow or thermal cycle, samples are tested and then measured again for warpage, contact alignment, and mating. A complete visual inspection is finished before packing.
FAQ
Q1: What is the standard MOQ?
A1: The standard MOQ is one full-container order. Different colors or models can be combined only when each resin, cavity, and molding run meets the minimum material-feeding and production requirement.
Q2: How are precision connector housings packed?
A2: Small housings can be packed in trays, tubes, reels, compartment bags, or layered cartons. The choice depends on pin protection, automation, static-control, and deformation requirements, and is confirmed with the approved sample.
Q3: Can the housing be used in an SMT reflow process?
A3: Yes, provided the resin grade, wall design, moisture condition, PCB restraint, and reflow profile are defined for the project. Trial parts must complete the agreed thermal cycle without unacceptable warpage or contact displacement.
Q4: Are stamped terminals included?
A4: Stamped terminals are included only after the terminal material, plating, stamping tolerance, insert-molding or assembly method, and electrical tests have been defined. Housing-only production is still available when the project uses an existing terminal supplier.
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